Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs.
Lars BrusbergAramais R. ZakharianSükrü Ekin KocabasJason R. GrenierChad C. TerwilligerAlan F. EvansPublished in: OFC (2020)
Keyphrases
- high density
- machine vision
- thin film
- physical design
- multichip module
- embedded systems
- high speed
- neural network
- imaging systems
- real time
- data center
- field programmable gate array
- smart camera
- laser beam
- application specific integrated circuits
- hierarchical clustering algorithms
- power distribution
- image sensor
- database systems
- case study
- databases