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Determination of temperature change inside IC packages during laser ablation of molding compound.

P. SchwindenhammerH. MurrayPhilippe DescampsPatrick Poirier
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • laser beam
  • integrated circuit
  • software packages
  • heat flow
  • databases
  • neural network
  • genetic algorithm
  • artificial intelligence
  • multiscale
  • low cost
  • high temperature