Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications.
M. TijeroXabier EguiluzJorge ElizaldeV. DiezA. ArriolaI. AranburuA. ZarketaM. Martinez-AgirreA. Martin-MayorM. M. Bou-aliPublished in: IEEE SENSORS (2017)
Keyphrases
- industrial applications
- industrial systems
- high speed
- high density
- health monitoring
- body sensor networks
- wireless networks
- wireless communication
- monitoring system
- real time
- computational modeling
- mobile devices
- communication technologies
- mobile ad hoc networks
- wifi
- high temperature
- neural network
- access points
- systems engineering
- data gathering
- integrated circuit
- wearable sensors
- medical devices
- communication networks
- ultra high