Electrical isolation and fanout in intra-chip optical interconnects.
Anand PappuAlyssa B. ApselPublished in: ISCAS (2) (2004)
Keyphrases
- printed circuit boards
- fiber optic
- power distribution
- power dissipation
- cmos technology
- physical characteristics
- low voltage
- high bandwidth
- chip design
- input output
- high density
- low cost
- visual inspection
- high speed
- analog vlsi
- image sensor
- transmission line
- integrated circuit
- low power
- power consumption
- single chip
- manufacturing process
- vlsi implementation
- programmable logic
- focal plane
- physical design
- power grid
- telecommunication networks
- r tree