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A 112 Gb/s All-Silicon Micro-Ring Photodetector for Datacom Applications.
Meer Sakib
Peicheng Liao
Ranjeet Kumar
Duanni Huang
Guan-Lin Su
Chaoxuan Ma
Haisheng Rong
Published in:
OFC (2020)
Keyphrases
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high speed
high density
low cost
real time
silicon dioxide
gallium arsenide
neural network
real world
similarity measure
cmos technology
plasma etching