Detecting Multiclass Defects of Printed Circuit Boards in the Molded-interconnect-device Manufacturing Process Using Deep Object Detection Networks.
Chun-Hsiang ChangHao-Wei ChenChun-Cheng LinPublished in: IEEM (2022)
Keyphrases
- multi class
- printed circuit boards
- manufacturing process
- object detection
- process control
- quality control
- manufacturing systems
- control system
- discrete event
- product design
- binary classification
- multiclass classification
- pairwise
- multiclass problems
- support vector machine
- multiple classes
- visual inspection
- surface defects
- cost sensitive
- feature selection
- process planning
- product quality
- multiclass learning
- complex systems
- support vector
- feature extraction
- machine learning