Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Alain PhommahaxayAnne JourdainGreet VerbinnenTobias WoitkePeter BissonMarkus GabrielWalter SpiessAlice GuerreroJeremy McCutcheonRama PuligaddaPieter BexAxel Van den EedeBart SwinnenGerald BeyerAndy MillerEric BeynePublished in: 3DIC (2011)
Keyphrases
- room temperature
- integrated circuit
- manufacturing process
- manufacturing processes
- genetic algorithm
- manufacturing systems
- quality control
- massively parallel
- semiconductor manufacturing
- knowledge base
- expert systems
- development process
- mathematical analysis
- process planning
- printed circuit boards
- process improvement