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Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration.
Tanay Karnik
Dinesh Somasekhar
Shekhar Borkar
Published in:
IET Comput. Digit. Tech. (2011)
Keyphrases
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three dimensional
high speed
x ray
data integration
key issues
low cost
image sequences
lessons learned
range images
human body
design methodology
high density
surface reconstruction
virtual reality
neural network
data model
depth map
circuit design
information integration
search engine