Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints.
Ankur JainSyed M. AlamScott PozderRobert E. JonesPublished in: IET Comput. Digit. Tech. (2011)
Keyphrases
- integrated circuit
- physical design
- printed circuit boards
- three dimensional
- design methodology
- chip design
- electrical properties
- manufacturing process
- design tools
- query optimization
- quality control
- database administrators
- electron beam
- genetic algorithm
- database
- manufacturing systems
- fuzzy sets
- relational databases