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Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition.
S. Y. Yang
W. J. Lee
S. H. Jeong
S. J. Lee
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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reliability assessment
high temperature
bp neural network model
power system
sufficient conditions
structural information
structural features
case study
file system
storage requirements
software testing
test cases
storage and retrieval
random access
processing capabilities