W. J. Lee

Publication Activity (10 Years)

Years Active: 2003-2006
Publications (10 Years): 0

Publications

S. Y. Yang, W. J. Lee, S. H. Jeong, S. J. Lee
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition. Microelectron. Reliab. 46 (9-11) (2006)
S. G. Lee, W. C. Park, W. J. Lee, T. D. Han, S. B. Yang
An effective hardware architecture for bump mapping using angular operation. Graphics Hardware (2003)