Affordable and Comprehensive Testing of 3-D Stacked Die Devices.
Jean-François CôtéJeff FanSean ShenGivargis DanialyMarcin LipinskiMichael GarbersWu YangMartin KeimAndreas GlowatzJoe ReynickAyush PatelJoanna MichnaPublished in: IEEE Des. Test (2022)