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IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures.

Helmut KöckVladimír KoselChristian DjelassiMichael GlavanovicsDionyz Pogany
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • heat transfer
  • finite element method
  • high temperature
  • information retrieval
  • high speed
  • test cases
  • power consumption
  • finite element
  • mathematical analysis
  • finite element analysis