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Postbond Test of Through-Silicon Vias With Resistive Open Defects.
Rosa Rodríguez-Montañés
Daniel Arumí
Joan Figueras
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2019)
Keyphrases
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high density
low cost
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databases
neural network
genetic algorithm
data center
data sets
data mining
machine learning
multiscale
steady state
statistical tests