Electronic packaging of SiC MOSFET-based devices for reliable high temperature operation.

Liang Yin Cheng-Po Chen Christopher Kapusta Reza Ghandi

Published in: ISCAS (2015)

Keyphrases

high temperature
cost effective
data sets
design automation
neural network
mobile devices
high density
diesel engine
high speed
design process
highly accurate
processing capabilities
handheld devices
embedded devices
electronic business
silicon dioxide