Semiconductor Packaging Revolution in the Era of Chiplets : Keynote 1.
Yasumitsu OriiPublished in: ITC-Asia (2023)
Keyphrases
- high density
- high speed
- key issues
- semiconductor manufacturing
- st century
- information explosion
- gallium arsenide
- big data
- plasma etching
- design process
- information technology
- data analysis
- video sequences
- knowledge discovery and data mining
- artificial intelligence
- low density
- field effect transistors
- neural network
- data sets