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An automated ultrasonic inspection approach for flip chip solder joint assessment.
Ryan S. H. Yang
Derek R. Braden
Guang-Ming Zhang
David M. Harvey
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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printed circuit boards
visual inspection
semi automated
low cost
computer assisted
vlsi implementation
high temperature
data sets
high speed
infrared
quality control
automated analysis
physical design
vlsi design