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Ryan S. H. Yang
Publication Activity (10 Years)
Years Active: 2012-2012
Publications (10 Years): 0
Top Topics
High Temperature
Infrared
Automated Analysis
Vlsi Design
Top Venues
Microelectron. Reliab.
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Publications
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Ryan S. H. Yang
,
Derek R. Braden
,
Guang-Ming Zhang
,
David M. Harvey
An automated ultrasonic inspection approach for flip chip solder joint assessment.
Microelectron. Reliab.
52 (12) (2012)