On the futility of thermal through-silicon-vias.

Chung-Han Chou Nien-Yu Tsai Hao Yu Yiyu Shi Jui-Hung Chien Shih-Chieh Chang

Published in: VLSI-DAT (2013)

Keyphrases

electrical properties
high density
integrated circuit
data center
low cost
multiscale
high speed
infrared