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Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding.
Y. J. Chen
C. C. Chang
H. Y. Lin
S. C. Hsu
C. Y. Liu
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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light emitting
light emitting diodes
integrated circuit
electron microscopy
x ray
light intensity
structuring elements
high density
thin film
electron beam
semiconductor manufacturing
high speed
digital images
visual quality
massively parallel
mechanical properties