Overlay High-Density Interconnect: A Chips-First Multichip Module Technology.

Wolfgang Daum William E. Burdick Jr.Raymond A. Fillion

Published in: Computer (1993)

Keyphrases

high density
multichip module
low density
close proximity
thin film
high power
high bandwidth
field effect transistors
cost effective
data center
power distribution
magnetic tape
magnetic recording
databases
computer simulation
chemical vapor deposition
artificial intelligence