William E. Burdick Jr.

Publication Activity (10 Years)

Years Active: 1993-1994
Publications (10 Years): 0

Publications

William E. Burdick Jr., Wolfgang Daum
High-Yield Multichip Modules Based on Minimal IC Pretest. ITC (1994)
Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion
Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. Computer 26 (4) (1993)