Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations.
Alessio SpessotShairfe Muhammad SalahuddinRicardo EscobarRomain RitzenthalerYang XiangRahul BudhwaniEugenio Dentoni LittaElena CapogrecoJoao BastosYangyin ChenNaoto HoriguchiPublished in: IMW (2022)
Keyphrases
- low power
- low power consumption
- low cost
- high speed
- power consumption
- single chip
- storage devices
- digital signal processing
- high power
- logic circuits
- wireless transmission
- left ventricle
- vlsi architecture
- real time
- vlsi circuits
- infrared
- image analysis
- file system
- flash memory
- image sensor
- mixed signal
- design methodology