Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning.
Zhuoyuan LiXianlong HongQiang ZhouShan ZengJinian BianWenjian YuHannah Honghua YangVijay PitchumaniChung-Kuan ChengPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2007)