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Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis.

Yu-Hsiang LinShi-Yu HuangKun-Han TsaiWu-Tung ChengStephen K. SunterYung-Fa ChouDing-Ming Kwai
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2013)
Keyphrases
  • high density
  • statistical analysis
  • image processing
  • data analysis
  • image analysis
  • wireless sensor networks
  • denoising
  • input data
  • post processing