Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse.
Jinwoo KimGauthaman MuraliHeechun ParkEric QinHyoukjun KwonVenkata Chaitanya Krishna ChekuriNihar DasariArvind SinghMinah LeeHakki Mert TorunKallol RoyMadhavan SwaminathanSaibal MukhopadhyayTushar KrishnaSung Kyu LimPublished in: DAC (2019)
Keyphrases
- software architecture
- design goals
- chip design
- design process
- single chip
- management system
- vlsi implementation
- architectural design
- hardware design
- design considerations
- loosely coupled
- high density
- design methodology
- network design
- circuit design
- integrated circuit
- conceptual model
- hardware architecture
- high speed
- low cost
- programmable logic
- user interface
- functional verification
- cmos image sensor