Interconnections-addressing the next challenge of IC technology (part I: integration and packaging trends).
José E. Schutt-AinéSung-Mo KangPublished in: Proc. IEEE (2001)
Keyphrases
- high density
- data processing
- case study
- technological advances
- table of contents
- image sequences
- integrated circuit
- st century
- cost effective
- personal computer
- data fusion
- technical solutions
- future trends
- information integration
- rapid development
- machine learning
- high speed
- object oriented
- relational databases
- learning environment
- database systems
- knowledge base
- information systems
- social networks