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Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle.
Jinlin Wang
Published in:
Microelectron. Reliab. (2002)
Keyphrases
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solid models
high speed
low cost
d objects
surface reconstruction
three dimensional
viewing angle
high density
analog vlsi
film thickness
laser beam
differential equations
range data
vlsi implementation
programmable logic
surface orientation
object surface