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Identifying Faulty TSVs in 3D Stacked IC during Pre-bond Testing.

Surajit Kumar RoySobitri ChatterjeeChandan Giri
Published in: ISED (2012)
Keyphrases
  • fault model
  • test cases
  • integrated circuit
  • data sets
  • real world
  • computer vision
  • training data
  • search algorithm
  • preprocessing
  • artificial neural networks
  • model based diagnosis
  • test generation
  • repair actions