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Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels.

Sergej DeutschKrishnendu Chakrabarty
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2014)
Keyphrases
  • data sets
  • neural network
  • information systems
  • expert systems
  • fault diagnosis
  • smart card
  • communication systems
  • fault detection
  • high levels
  • structural model
  • power losses