Surface Void Migration in Copper (Cu) VLSI Interconnect.

D. J. Pete J. B. Helonde Rohan Bhattacharya

Published in: ICETET (2009)

Keyphrases

high speed
mechanical properties
three dimensional
d objects
signal processing
range data
real time
power dissipation
surface patches
surface fitting
shape index
surface features
surface reconstruction
normal vectors
surface points
surface model
free form
multi view
vlsi design
object recognition
vlsi circuits