Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle.
Dong LiuChek Sing TeoWenyu LiangKok Kiong TanPublished in: IEEE Trans Autom. Sci. Eng. (2019)
Keyphrases
- high accuracy
- detection method
- cost function
- probabilistic model
- experimental evaluation
- significant improvement
- similarity measure
- optimization algorithm
- computational cost
- pairwise
- preprocessing
- cooperative
- image segmentation
- prior knowledge
- mutual information
- distributed systems
- support vector machine svm
- segmentation algorithm
- objective function
- detection algorithm
- segmentation method
- high precision
- optimization method
- real valued