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High temperature degradation of palladium coated copper bond wires.

Jörg C. KrinkeDragica DragicevicSusann LeinertErik FrießJoachim Glück
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • high temperature
  • wire bonding
  • bond pad
  • stress response
  • thin film
  • diesel engine
  • wire bond shear test
  • genetic algorithm
  • power supply
  • silicon dioxide