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Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging.

Wei MengQinghua ZengYong GuanJing ChenYufeng Jin
Published in: NEMS (2016)
Keyphrases
  • reliability analysis
  • condition monitoring
  • genetic algorithm
  • artificial intelligence
  • evolutionary algorithm
  • text mining
  • infrared
  • fault diagnosis
  • input output
  • statistical models