Switching and heat-dissipation performance analysis of an LTCC-based leadless surface mount package using a power factor correction converter.
Dong Yun JungHyun Gyu JangDoohyung ChoSungkyu KwonJongil WonSeong Hyun LeeKun Sik ParkJong-Won LimYong Ha LeePublished in: ICEIC (2021)