A testing method for assessing solder joint reliability of FCBGA packages.
Jinlin WangH. K. LimH. S. LewWoon Theng SawChew Hong TanPublished in: Microelectron. Reliab. (2004)
Keyphrases
- cost function
- optimization method
- synthetic data
- high accuracy
- test data
- segmentation method
- detection method
- preprocessing
- significant improvement
- main contribution
- experimental evaluation
- evaluation method
- clustering method
- optimization algorithm
- probabilistic model
- image processing
- pairwise
- dynamic programming
- theoretical analysis
- model selection
- prior knowledge
- detection algorithm
- edge detection
- computational complexity
- training data
- test cases
- decision trees
- mathematical model
- support vector machine
- machine learning
- data sets