Woon Theng Saw

Publication Activity (10 Years)

Years Active: 2004-2004
Publications (10 Years): 0

Publications

Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan
A testing method for assessing solder joint reliability of FCBGA packages. Microelectron. Reliab. 44 (5) (2004)