Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs.
Tilo PollerSalvatore D'ArcoMagnar HernesAtle Rygg ÅrdalJosef LutzPublished in: Microelectron. Reliab. (2013)
Keyphrases
- electrical power
- power system
- transmission line
- electrical properties
- electro mechanical
- finite element analysis
- power supply
- infrared
- factors influencing
- power grid
- physical characteristics
- finite element model
- bin packing
- human behaviour
- high temperature
- packing problem
- real time
- social influence
- artificial intelligence
- equivalent circuit
- learning algorithm