In-situ X-ray μLaue diffraction study of copper through-silicon vias.
Dario Ferreira SanchezShay RebohMonica Larissa Djomeni WeleguelaJean-Sébastien MichaOdile RobachThierry MourierPatrice GergaudPierre BleuetPublished in: Microelectron. Reliab. (2016)