3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration.
Damien LambertJeff RahnMajid SodagarMurtaza AskariPaveen ApiratikulJohn Y. SpannThang PhamYishen HuangStephen KrasulickPublished in: OFC (2023)
Keyphrases
- integrated circuit
- printed circuit boards
- metal oxide semiconductor
- built in self test
- high speed
- low cost
- machine vision
- image sensor
- high density
- analog vlsi
- imaging systems
- single chip
- physical characteristics
- real time
- circuit design
- high resolution
- optimal configuration
- programmable logic
- image sequences
- image processing