Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies.
Olli NousiainenL. LehtiniemiT. KangasvieriRisto RautioahoJ. VähäkangasPublished in: Microelectron. Reliab. (2008)
Keyphrases
- electron microscopy
- x ray
- infrared
- thin film
- finite element analysis
- solder ball connect
- visible spectrum
- power plant
- wide range
- machine learning
- thermal imaging
- thermal images
- high temperature
- electrical properties
- computer vision
- evolutionary algorithm
- injection lasers
- thermal conductivity
- air temperature
- thermal infrared
- room temperature
- three dimensional
- database systems
- steady state
- artificial neural networks