Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages.
Po-Yao ChuangFrancesco LorenzelliSreejit ChakravartySlimane BoutobzaCheng-Wen WuGeorges G. E. GielenErik Jan MarinissenPublished in: 3DIC (2023)