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Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications.
A. Salahouelhadj
M. Martiny
Sebastien Mercier
L. Bodin
D. Manteigas
B. Stephan
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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high density
printed circuit boards
low density
visual inspection
integrated circuit
high speed
high power
close proximity
magnetic recording
thin film
infrared
high bandwidth
data center
surface defects
manufacturing process
case study
software development
data streams
database