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Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures.

Frédéric MartyLionel RousseauBassam SaadanyB. MercierOlivier FrançaisY. MitaTarik Bourouina
Published in: Microelectron. J. (2005)
Keyphrases
  • plasma etching
  • three dimensional
  • thin film
  • aspect ratio
  • high density
  • integrated circuit
  • field effect transistors
  • multi view
  • natural images