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On Through Silicon Vias as used in three dimensional integrated circuits.
Robert Minvielle
Magdy A. Bayoumi
Published in:
ICEAC (2013)
Keyphrases
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integrated circuit
three dimensional
metal oxide semiconductor
high density
low cost
range images
multi view
d objects
high speed
x ray
image sequences
electron beam
transmission electron microscopy
human body
depth map
liquid crystal
real time