On Through Silicon Vias as used in three dimensional integrated circuits.

Robert Minvielle Magdy A. Bayoumi

Published in: ICEAC (2013)

Keyphrases

integrated circuit
three dimensional
metal oxide semiconductor
high density
low cost
range images
multi view
d objects
high speed
x ray
image sequences
electron beam
transmission electron microscopy
human body
depth map
liquid crystal
real time