Interfacial thermal stresses in solder joints of leadless chip resistors.
Hamid R. GhorbaniJan K. SpeltPublished in: Microelectron. Reliab. (2006)
Keyphrases
- low cost
- high speed
- infrared
- high density
- vlsi implementation
- analog vlsi
- programmable logic
- integrated circuit
- solder ball connect
- circuit design
- power plant
- single chip
- thermal imaging
- visible spectrum
- finite element analysis
- thermal conductivity
- host computer
- high temperature
- room temperature
- vlsi design
- physical design
- information systems
- genetic algorithm
- solid models
- air conditioning
- functional verification
- real time