Jan K. Spelt

Publication Activity (10 Years)

Years Active: 2006-2012
Publications (10 Years): 0

Top Topics

Prediction Accuracy

Printed Circuit Boards

Visual Inspection

Top Venues

Microelectron. Reliab.

Publications

Siva P. V. Nadimpalli, Jan K. Spelt
Prediction of pad cratering fracture at the copper pad - Printed circuit board interface. Microelectron. Reliab. 52 (7) (2012)
O. Belashov, Jan K. Spelt
Thermal stress concentration factors for defects in plated-through-vias. Microelectron. Reliab. 48 (2) (2008)
Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints. Microelectron. Reliab. 48 (3) (2008)
Rex Lam, Jan K. Spelt
Comparison of Weibull small samples using Monte Carlo simulations. Qual. Reliab. Eng. Int. 23 (4) (2007)
Hamid R. Ghorbani, Jan K. Spelt
Interfacial thermal stresses in solder joints of leadless chip resistors. Microelectron. Reliab. 46 (5-6) (2006)
Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectron. Reliab. 46 (2-4) (2006)