Polina Snugovsky

Publication Activity (10 Years)

Years Active: 2006-2007
Publications (10 Years): 0

Publications

A. R. Zbrzezny, Polina Snugovsky, D. D. Perovic
Impact of board and component metallizations on microstructure and reliability of lead-free solder joints. Microelectron. Reliab. 47 (12) (2007)
Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectron. Reliab. 46 (2-4) (2006)