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Damascene copper electroplating for chip interconnections.
Panayotis C. Andricacos
Cyprian Uzoh
John O. Dukovic
Jean Horkans
Hariklia Deligianni
Published in:
IBM J. Res. Dev. (1998)
Keyphrases
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high density
integrated circuit
printed circuit boards
electron beam
real time
databases
artificial intelligence
ni fe
built in self test