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Damascene copper electroplating for chip interconnections.

Panayotis C. AndricacosCyprian UzohJohn O. DukovicJean HorkansHariklia Deligianni
Published in: IBM J. Res. Dev. (1998)
Keyphrases
  • high density
  • integrated circuit
  • printed circuit boards
  • electron beam
  • real time
  • databases
  • artificial intelligence
  • ni fe
  • built in self test