Al surface morphology effect on flip-chip solder bump shear strength.

Esther Wai Ching Yau Jing Feng Gong Philip Chan

Published in: Microelectron. Reliab. (2004)

Keyphrases

mechanical properties
three dimensional
solid models
printed circuit boards
d objects
high speed
surface features
low cost
range data
surface reconstruction
high density
free form
single chip
analog vlsi
vector field
vlsi implementation
image analysis
image processing